JPH0252432B2 - - Google Patents
Info
- Publication number
- JPH0252432B2 JPH0252432B2 JP62175765A JP17576587A JPH0252432B2 JP H0252432 B2 JPH0252432 B2 JP H0252432B2 JP 62175765 A JP62175765 A JP 62175765A JP 17576587 A JP17576587 A JP 17576587A JP H0252432 B2 JPH0252432 B2 JP H0252432B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- undercoat layer
- aperture
- conductive patterns
- spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62175765A JPS6419795A (en) | 1987-07-14 | 1987-07-14 | Flexible printed wiring board with multilayered pattern and manufacture thereof |
KR8712061A KR920005462B1 (en) | 1987-07-14 | 1987-10-30 | Flexible printed wiring board with multilayered pattern and manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62175765A JPS6419795A (en) | 1987-07-14 | 1987-07-14 | Flexible printed wiring board with multilayered pattern and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6419795A JPS6419795A (en) | 1989-01-23 |
JPH0252432B2 true JPH0252432B2 (en]) | 1990-11-13 |
Family
ID=16001867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62175765A Granted JPS6419795A (en) | 1987-07-14 | 1987-07-14 | Flexible printed wiring board with multilayered pattern and manufacture thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6419795A (en]) |
KR (1) | KR920005462B1 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
KR100494679B1 (ko) * | 1998-12-18 | 2005-09-26 | 비오이 하이디스 테크놀로지 주식회사 | 플렉서블 프린티드 서킷 |
KR100395814B1 (ko) * | 2000-11-14 | 2003-08-27 | 삼성에스디아이 주식회사 | 단선 방지형 유연성 프린트 회로 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517518B2 (en]) * | 1972-01-28 | 1980-05-12 | ||
JPS50135559A (en]) * | 1974-04-17 | 1975-10-27 | ||
JPS6149491A (ja) * | 1984-08-18 | 1986-03-11 | 松下電器産業株式会社 | セラミツク多層配線基板 |
JPS6284975U (en]) * | 1985-11-18 | 1987-05-30 |
-
1987
- 1987-07-14 JP JP62175765A patent/JPS6419795A/ja active Granted
- 1987-10-30 KR KR8712061A patent/KR920005462B1/ko not_active Expired
Also Published As
Publication number | Publication date |
---|---|
KR920005462B1 (en) | 1992-07-04 |
KR890003269A (ko) | 1989-04-13 |
JPS6419795A (en) | 1989-01-23 |
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